Enhanced Nucleate Boiling for AI Chip Cooling

Advanced AI processors generate extreme heat fluxes that jeopardize reliability. Conventional single-phase liquid cooling is approaching its thermal ceiling.

Develop and validate a two-phase enhanced nucleate boiling approach capable of handling high-heat-flux conditions in next-generation AI/data-center hardware.

Modeled enhanced nucleate boiling with high-density nucleation sites in ANSYS Fluent. Cross-validated against an independent Energy method (finite-volume) solution in MATLAB. Conducted mesh-sensitivity study, parametric analysis, and boundary-condition sweeps.

55kW/(m²·K)Boiling HTC

Achieved 55 kW/(m²·K) heat transfer coefficient in simulation — an 18–20 °C reduction in chip junction temperature vs. baseline. Quantitative MATLAB–Fluent agreement confirmed simulation fidelity. Delivered a structured technical report and scalable methodology.

18–20°CJunction temp ↓